rincian produk

Rumah Produk

Loranger 006004006J6617 Test Socket 6 I/O dan 0.23/0.22mm Pitch BGA/CSP Socket Life Cycle 000 siklus

Nama merek:	Loranger
Nomor Model:	Ball Grid Array (BGA)/Chip Scale Package (CSP) Sockets

Informasi Rinci

Deskripsi Produk

Informasi Rinci

Socket Size:

15mm x 15mm

Manufacturer:

Loranger

Insulation Resistance:

1000 MΩ

Number Of Pins:

Pin Pitch:

0.65 mm

Contact Force:

50g

Life Cycle:

100,000 cycles

Contact Resistance:

50 mΩ

Voltage Rating:

100 V

Pin Count:

100

Dimensions:

25 mm x 25 mm x 10 mm

Application:

Electronic Testing

Compatibility:

Multiple IC Packages

Socket Type:

Test Socket

Current Rating:

1 A

Menyoroti:

Soket uji BGA/CSP

0.23/0.22mm Pitch Test Socket

006004006J6617 Soket uji Loranger

Deskripsi Produk

0.22 mm Pitch dan Greater
Mengakomodasi Variasi Ketinggian Paket
Pilihan Soket Non-Magnetik Tersedia
Kesesuaian Paket yang Tepat dan Dikontrol Tepat
Kontak Sambungkan bola Solder ke Board Pad
Pemanas panas opsional

Item #	Nama Item	Nama Paket	Jumlah input/output (I/O)	Pitch
006004006J6617	6 Input/Output (I/O) dan 0.23/0.22 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	6	Berbagai0.22 mm0.23 mm
007SQ 004J6617	4 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	4	0.40 mm0.0157 dalam
007SQ 004J6618A	4 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	4	0.40 mm0.0157 dalam
008008005J6617	5 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	5	0.40 mm0.0157 dalam
008SQ 004J6617	4 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	4	0.40 mm0.0157 dalam
008SQ 008J5617	8 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	8	0.40 mm0.0157 dalam
008SQ 008J6618A	8 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	8	0.40 mm0.0157 dalam
008SQ 008J6618B	8 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	8	0.40 mm0.0157 dalam
009SQ 004J6617	4 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	4	0.50 mm0.02 dalam
009SQ 004J6618A	4 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	4	0.50 mm0.02 dalam
009SQ 004U6617	4 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	4	0.50 mm0.02 dalam
010008005J6617	5 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	5	0.40 mm0.0157 dalam
010009004U6617	4 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	4	0.50 mm0.02 dalam
010SQ 004J6617	4 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	4	0.50 mm0.02 dalam
011007005J6617	5 Input/Output (I/O) dan 0,35 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA	5	0.35 mm0.0138 dalam
012008004J6617	4 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	4	0.40 mm0.0157 dalam
012008006J6617	6 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	6	0.40 mm0.0157 dalam
012SQ 004J6617	4 Input/Output (I/O) dan 0,60 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	4	0.60 mm0.024 dalam
012SQ 009J6618A	9 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	9	0.40 mm0.016 dalam
013008005J6617	5 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	5	0.50 mm0.02 dalam
013008005U6617	5 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	5	0.50 mm0.019685 dalam
013008006J6617	6 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	6	0.50 mm0.02 dalam
013009005J6617	5 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	5	0.50 mm0.019685 dalam
013009005U6617	5 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	5	0.50 mm0.019685 dalam
013010006J6617	6 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	6	0.40 mm0.0157 dalam
013012009J6617	9 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	9	0.40 mm0.0157 dalam
013SQ 008J6617	8 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	8	0.50 mm0.0197 dalam
013SQ 016J6617	16 Input/Output (I/O) dan 0,35 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	16	0.35 mm0.0138 dalam
014007006J6617	6 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	6	0.40 mm0.0157 dalam
014009006J6617	6 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	6	0.50 mm0.02 dalam
014010005J6617	5 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	5	0.50 mm0.0197 dalam
014010016J6617	8 Input/Output (I/O) Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	8	Berbagai
014SQ 009U6617	9 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	9	0.50 mm0.02 dalam
015008006J6617	6 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	6	0.40 mm0.0157 dalam
015008016J6617	8 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	8	0.40 mm0.0157 dalam
015010006J6617	6 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	6	0.50 mm0.02 dalam
015010006J6618A	6 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	6	0.50 mm0.02 dalam
015010006J6618B	6 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	6	0.50 mm0.02 dalam
015010006J6618C	6 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	6	0.50 mm0.02 dalam
015010006J6618D	6 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	6	0.50 mm0.02 dalam
015SQ 008J6618B	8 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA	8	0.50 mm0.02 dalam
015SQ 009J6618A	9 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	MOSFET BGA	9	0.50 mm0.02 dalam
015SQ 009J6618B	9 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA	9	0.50 mm0.02 dalam
015SQ 009J6618D	9 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA	9	0.50 mm0.02 dalam
016008016J6617	8 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	8	0.40 mm0.0157 dalam
016008016J6618A	8 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	8	0.40 mm0.0157 dalam
016008016J6618B	8 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	8	0.40 mm0.016 dalam
016012012J6617	12 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	12	0.40 mm0.0157 dalam
016012012J6618A	12 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	12	0.40 mm0.0157 dalam
016013012J6617	12 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	12	0.40 mm0.016 dalam
016014012J6617	12 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	12	0.40 mm0.016 dalam
016SQ 004U6617	4 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	4	0.50 mm0.02 dalam
016SQ 016J6617	16 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA	16	0.40 mm0.016 dalam
017009006J6617	6 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	6	0.50 mm0.0197 dalam
017014012J6617	12 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	12	0.40 mm0.0157 dalam
019010008J6617	4 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	4	0.50 mm0.0197 dalam
019011008J6617	4 Input/Output (I/O) dan 0,68 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	4	0.68 mm0.0268 dalam
019015020J6617	20 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	20	0.40 mm0.0157 dalam
019019020J6617	20 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	20	0.40 mm0.0157 dalam
019SQ 025J6617	25 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	25	0.40 mm0.0157 dalam
020009008U6617	8 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	8	0.50 mm0.02 dalam
020012008J6617	8 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	8	0.50 mm0.02 dalam
020014011J6617	11 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	11	0.50 mm0.02 dalam
020014012U6617	12 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	12	0.50 mm0.02 dalam
020015010J6617	10 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	10	0.50 mm0.02 dalam
020015012J6617	12 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	12	0.50 mm0.02 dalam
020016012J6617	12 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	12	0.50 mm0.02 dalam
020016020J6617	20 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	20	0.40 mm0.0157 dalam
020017020J6617	20 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	20	0.40 mm0.0157 dalam
020SQ 008J6617	8 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	8	0.50 mm0.02 dalam
020SQ 008U6617	8 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	8	0.50 mm0.02 dalam
020SQ 008U6618A	8 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	8	0.50 mm0.02 dalam
020SQ 016J6617	16 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	16	0.50 mm0.02 dalam
020SQ 025J6617	25 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	25	0.40 mm0.018 dalam
020SQ 025J6618A	25 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	25	0.40 mm0.018 dalam
021015015J6617	15 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	15	0.40 mm0.018 dalam
021020016J6617	16 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	16	0.50 mm0.02 dalam
021020016J6618A	16 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	16	0.50 mm0.02 dalam
022009010J6617	10 Input/Output (I/O) Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	10	Berbagai
022014008U6617	8 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	8	0.50 mm0.02 dalam
022015008J6617	8 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	8	0.50 mm0.02 dalam
022022025J6617	25 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	25	0.40 mm0.0157 dalam
022SQ 025J6617	25 Input/Output (I/O) dan 0,45 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	25	0.45 mm0.0177 dalam
023017020J6617	20 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	20	0.40 mm0.0157 dalam
024020030J6617	30 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	30	0.40 mm0.0157 dalam
024022030J6617	30 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	30	0.40 mm0.0157 dalam
025011010J6617	10 Input/Output (I/O) Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	10	Berbagai
025022030J6617	30 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	30	0.40 mm0.0157 dalam
025024030J6617	30 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	30	0.40 mm0.0157 dalam
025025025J6617	25 Input/Output (I/O) dan 0,45 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	25	0.45 mm0.0177 dalam
025SQ 015U6617	15 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	15	0.50 mm0.02 dalam
025SQ 016U6617	16 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	16	0.50 mm0.02 dalam
026017015J6617	15 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	15	0.50 mm0.197 dalam
026022020J6617	20 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	20	0.50 mm0.0197 dalam
026025036J6617	36 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	36	0.40 mm0.0157 dalam
026025036J6618A	36 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	36	0.40 mm0.0157 dalam
027020030J6617	30 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	30	0.40 mm0.0157 dalam
027025025U6617	25 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	25	0.50 mm0.02 dalam
027026025J6617	25 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	25	0.50 mm0.02 dalam
028022009J6617	9 Input/Output (I/O) dan 0,80 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	9	0.80 mm0.0315 dalam
028022009J6618A	9 Input/Output (I/O) dan 0,80 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	9	0.80 mm0.0315 dalam
028025036J6617	36 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	36	0.40 mm0.0157 dalam
029027042J6617	42 Input/Output (I/O) Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	42	Berbagai
029SQ 025J6617	25 Input/Output (I/O) dan 0,45 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	25	0.45 mm0.0177 dalam
030020008U6617	8 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	8	0.65 mm0.026 dalam
030021034J6617	34 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	34	0.40 mm0.016 dalam
030028022J6617	22 Input/Output (I/O) Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	22	Berbagai
030SQ 016U6617	16 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	16	0.50 mm0.02 dalam
030SQ 024U6617	24 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	24	0.50 mm0.02 dalam
030SQ 025U6617	25 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	25	0.50 mm0.02 dalam
030SQ 032J6617	32 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	32	0.40 mm0.0157 dalam
030SQ 036J6617	36 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	36	0.40 mm0.0157 dalam
030SQ 049J6617	49 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	49	0.40 mm0.0157 dalam
031020029J6617	29 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	29	0.40 mm0.016 dalam
031021024J6617	24 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	24	0.50 mm0.197 dalam
031024042J6617	42 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	42	0.40 mm0.016 dalam
033029049J6617	49 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	49	0.40 mm0.016 dalam
033029049J6618A	49 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	49	0.40 mm0.016 dalam
034022040J6617	40 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	40	0.40 mm0.0157 dalam
034026042J6617	42 Input/Output (I/O) dan 0,44 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	42	0.44 mm0.0173 dalam
034029040J6617	40 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	40	0.50 mm0.0197 dalam
034029049J6617	49 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	49	0.40 mm0.0157 dalam
035023015U6617	15 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	15	0.50 mm0.02 dalam
035025048J6617	48 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	0.40 mm0.0157 dalam
035025048J6618A	48 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	0.40 mm0.0157 dalam
035SQ 004B6617	4 Input/Output (I/O) dan 2.5 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	4	2.5 mm0.098 dalam
035SQ 036J6617	36 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	36	0.50 mm0.0197 dalam
035SQ 036J6618A	36 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	36	0.50 mm0.0197 dalam
035SQ 049J6617	49 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	49	0.50 mm0.0197 dalam
035SQ 049J6618A	49 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	49	0.40 mm0.0157 dalam
036031049J6617	49 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	49	0.40 mm0.4 dalam
036SQ 036J6617	36 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	36	0.50 mm0.0197 dalam
037035024J6617	24 Input/Output (I/O) dan 0,57 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	24	0.57 mm0.0224 dalam
037038049J6617	49 Input/Output (I/O) dan 0,48 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	49	0.48 mm0.0189 dalam
037SQ 049U6617	49 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	49	0.50 mm0.02 dalam
039019032J6617	32 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	32	0.40 mm0.0157 dalam
040019014J6617	10 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	10	0.8 mm0.031 dalam
040026014J6617	14 Input/Output (I/O) dan 0,62 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	14	0.62 mm0.0244 dalam
040030020U6617	20 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	20	0.65 mm0.026 dalam
040031043J6617	43 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	43	0.40 mm0.0157 dalam
040032014U6617	14 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	14	0.8 mm0.031 dalam
040035014U6617	14 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	14	0.8 mm0.031 dalam
040035030J6617	30 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	30	0.65 mm0.026 dalam
040SQ 040U6617	40 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	40	0.50 mm0.0197 dalam
040SQ 048U6617	48 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	0.50 mm0.02 dalam
040SQ 048U6618A	48 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	0.50 mm0.02 dalam
040SQ 049U6617	49 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	49	0.50 mm0.02 dalam
040SQ 049U6618A	49 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	49	0.50 mm0.02 dalam
040SQ 049U6618B	49 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	49	0.50 mm0.02 dalam
040SQ 064J6618A	64 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	64	0.40 mm0.0157 dalam
040SQ 064J6618B	64 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	64	0.40 mm0.0157 dalam
041SQ 025U6617	25 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	25	0.8 mm0.031 dalam
042031049J6617	49 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	49	0.40 mm0.0157 dalam
042037037J6617	37 Input/Output (I/O) Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	37	Berbagai
043037099J6617	99 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	99	0.40 mm0.0157 dalam
043038099J6617	99 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	99	0.40 mm0.0157 dalam
04481 420 661A	384 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	384	1 mm0.039 dalam
044SQ 032U6617	32 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	32	0.65 mm0.026 dalam
044SQ 032U6619	32 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	32	0.65 mm0.026 dalam
045043105J6617	105 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	105	0.40 mm0.016 dalam
045SQ 081J6617	81 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	81	0.50 mm0.0197 dalam
050SQ 025U6617	25 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	25	0.8 mm0.031 dalam
050SQ 031U6617	31 Input/Output (I/O) dan 0,75 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	31	0.75 mm0.03 dalam
050SQ 032U6618B	80 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	80	0.50 mm0.02 dalam
050SQ 049U6617	49 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	49	0.65 mm0.026 dalam
050SQ 052U6617	52 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	52	0.50 mm0.02 dalam
050SQ 054J6617	54 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	54	0.50 mm0.02 dalam
050SQ 068U6617	68 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	68	0.50 mm0.02 dalam
050SQ 072U6617	72 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	72	0.50 mm0.02 dalam
050SQ 079J6617	79 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	79	0.50 mm0.0197 dalam
050SQ 080J6617	80 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	80	0.50 mm0.02 dalam
050SQ 080U6617	80 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	80	0.50 mm0.02 dalam
050SQ 081U6617	81 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	81	0.50 mm0.02 dalam
050SQ 081U6618A	70 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	70	0.50 mm0.02 dalam
050SQ 081U6618B	60 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	60	0.50 mm0.02 dalam
050SQ 105J6617	105 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	105	0.40 mm0.0157 dalam
050SQ 121J6617	121 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	121	0.40 mm0.0157 dalam
055054169J6617	145 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	145	0.40 mm0.0157 dalam
055SQ 098U6617	98 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	98	0.50 mm0.02 dalam
060050084U6617	84 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	84	0.50 mm0.0197 dalam
060SQ 032B6617	32 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	32	1 mm0.039 dalam
060SQ 036U6617	36 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	36	0.8 mm0.031 dalam
060SQ 036U6618A	36 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	LFBGA	36	0.8 mm0.031 dalam
060SQ 037J6618D	37 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	37	0.50 mm0.02 dalam
060SQ 048U6617	48 Input/Output (I/O) dan 0,707 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	0.707 mm0.0278 dalam
060SQ 048U6618A	48 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	0.50 mm0.02 dalam
060SQ 049U6617	49 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	49	0.8 mm0.031 dalam
060SQ 049U6618A	49 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	49	0.8 mm0.031 dalam
060SQ 056J6617	56 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	56	0.50 mm0.02 dalam
060SQ 056U6617	56 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	56	0.50 mm0.02 dalam
060SQ 056U6618A	56 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	56	0.50 mm0.02 dalam
060SQ 056U6618B	56 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	56	0.50 mm0.02 dalam
060SQ 056U6618C	56 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	TFBGA	56	0.50 mm0.02 dalam
060SQ 064J6618A	64 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	64	0.50 mm0.02 dalam
060SQ 064U6617	64 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	64	0.50 mm0.02 dalam
060SQ 064U6618A	64 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	64	0.50 mm0.02 dalam
060SQ 080U6617	80 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	80	0.50 mm0.02 dalam
060SQ 080U6618A	80 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	80	0.50 mm0.02 dalam
060SQ 081U6617	60 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	60	0.50 mm0.02 dalam
060SQ 088U6617	88 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	88	0.50 mm0.02 dalam

063051022J6617	40 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	40	0.65 mm0.026 dalam
065026040U6617	40 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	40	0.65 mm0.026 dalam
065062131J6617	131 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	131	0.50 mm0.0197 dalam
070065112P6617	112 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	112	0.50 mm0.02 dalam
070SQ 048U1618A	48 Input/Output (I/O) dan 0,75 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	0.75 mm0.03 dalam
070SQ 048U6617	48 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	0.8 mm0.031 dalam
070SQ 048U6618B	48 Input/Output (I/O) dan 0,75 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	0.75 mm0.03 dalam
070SQ 048U6618C	48 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	0.8 mm0.031 dalam
070SQ 049U6617	49 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	49	0.8 mm0.031 dalam
070SQ 049U6618A	49 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	FPBGA	49	0.8 mm0.031 dalam
070SQ 049U6618B	49 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	49	0.8 mm0.031 dalam
070SQ 064U6617	64 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	64	0.8 mm0.031 dalam
070SQ 071U6617	71 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	71	0.65 mm0.026 dalam
070SQ 080U6617	80 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	80	0.50 mm0.02 dalam
070SQ 084U6617	84 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	84	0.50 mm0.02 dalam
070SQ 100J6618B	100 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	100	0.65 mm0.026 dalam
070SQ 100U6617	100 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	100	0.50 mm0.02 dalam
070SQ 100U6618A	100 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	100	0.65 mm0.026 dalam
070SQ 100U6618B	100 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	100	0.65 mm0.026 dalam
070SQ 112U6617	112 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	TFBGA	112	0.50 mm0.02 dalam
070SQ 113U6617	113 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	113	0.50 mm0.02 dalam
070SQ 124U6617	124 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	FCBGA	124	0.50 mm0.02 dalam
070SQ 144U6617	143 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	143	0.50 mm0.02 dalam
070SQ 144U6618A	68 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	68	0.50 mm0.02 dalam
070SQ 154U6617	154 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	154	0.50 mm0.0197 dalam
070SQ 169J6617	169 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	169	0.50 mm0.0197 dalam
070SQ 169U6617	169 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	169	0.50 mm0.02 dalam
070SQ 169U6618A	169 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	169	0.50 mm0.02 dalam
070SQU143U6618	143 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	143	0.50 mm0.02 dalam
070SQU144U6618	144 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	144	0.50 mm0.02 dalam
072063044U6617	44 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	44	0.8 mm0.031 dalam
074071078J6617	78 Input/Output (I/O) Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	78	Berbagai
076070019J6617	52 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	52	0.8 mm0.031 dalam
076070019J6618A	52 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	52	0.8 mm0.031 dalam
076070019U6617	19 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	19	0.8 mm0.031 dalam
078057046U6617	46 Input/Output (I/O) dan 0,75 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	46	0.75 mm0.03 dalam
080050135J6617	135 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	135	0.50 mm0.02 dalam
080060024J6617	24 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	24	1 mm0.039 dalam
080070040U6617	46 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	46	0.50 mm0.02 dalam
080070046U6617	46 Input/Output (I/O) dan 0,75 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	46	0.75 mm0.03 dalam
080070048U6618A	48 Input/Output (I/O) dan 0,75 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	0.75 mm0.03 dalam
080SQ 043B6617	43 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	43	1 mm0.039 dalam
080SQ 049B6617	49 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	49	1 mm0.039 dalam
080SQ 064J6617	64 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	64	0.8 mm0.031 dalam
080SQ 064U6617	64 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	64	0.8 mm0.031 dalam
080SQ 064U6618A	64 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	64	0.8 mm0.031 dalam
080SQ 064U6618B	64 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	SSBGA	64	0.8 mm0.031 dalam
080SQ 064U6618C	64 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	64	0.8 mm0.031 dalam
080SQ 065J6617	65 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	65	0.8 mm0.031 dalam
080SQ 072U6617	72 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	72	0.8 mm0.031 dalam
080SQ 073U6617	73 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	73	0.8 mm0.031 dalam
080SQ 080U6617	80 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	80	0.8 mm0.031 dalam
080SQ 081U6617	81 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	81	0.8 mm0.031 dalam
080SQ 081U6618A	81 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	81	0.8 mm0.031 dalam
080SQ 084U6617	84 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	84	0.50 mm0.02 dalam
080SQ 084U6618A	84 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	PBGA	84	0.50 mm0.02 dalam
080SQ 096U6617	96 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	96	0.50 mm0.02 dalam
080SQ 096U6618A	96 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	96	0.50 mm0.02 dalam
080SQ 096U6618B	96 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	96	0.50 mm0.02 dalam
080SQ 124U6617	124 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	FCBGA	124	0.50 mm0.02 dalam
080SQ 132U6617	132 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	132	0.50 mm0.02 dalam
080SQ 132U6618A	132 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	132	0.50 mm0.02 dalam
080SQ 132U6618B	132 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	132	0.50 mm0.02 dalam
080SQ 167U6617	167 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	PBGA	167	0.50 mm0.02 dalam
080SQ 169U6617	169 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	PBGA	169	0.50 mm0.02 dalam
080SQ 192C6618A	64 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	64	0.8 mm0.0315 dalam
080SQ 196U6617	196 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	196	0.50 mm0.02 dalam
080SQ 196U6618A	196 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	196	0.50 mm0.02 dalam
080SQ 196U6618B	196 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	196	0.50 mm0.02 dalam
080SQ 225J6617	225 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	225	0.50 mm0.0197 dalam
080SQ 225U6617	225 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	225	0.50 mm0.0197 dalam
080SQ 244J6617	244 Input/Output (I/O) dan 0,40 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	244	0.40 mm0.016 dalam
080SQU064U6617	64 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	PBGA	64	0.8 mm0.031 dalam
081061048J6617	48 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	0.8 mm0.031 dalam
081061048J6618A	48 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	0.8 mm0.031 dalam
081061048U6617	48 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	0.8 mm0.031 dalam
085069046U6617	46 Input/Output (I/O) dan 0,75 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	46	0.75 mm0.03 dalam
088072046U6617	46 Input/Output (I/O) dan 0,75 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	46	0.75 mm0.03 dalam
088080064J6617	64 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	64	0.8 mm0.0315 dalam
090070048J6617	48 Input/Output (I/O) dan 0,75 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	0.75 mm0.03 dalam
090080048U6617	48 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	0.8 mm0.031 dalam
090080048U6618A	48 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	FPBGA	48	0.8 mm0.031 dalam
090080048U6618B	48 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	0.8 mm0.031 dalam
090SQ 064B6617	64 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	64	1 mm0.039 dalam
090SQ 064B6618A	64 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	LFBGA	64	1 mm0.039 dalam
090SQ 080U6617	80 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	80	0.8 mm0.031 dalam
090SQ 080U6618A	80 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	80	0.8 mm0.031 dalam
090SQ 081U6617	81 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	81	0.8 mm0.031 dalam
090SQ 081U6618A	81 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	81	0.8 mm0.031 dalam
090SQ 100J6618B	100 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	100	0.8 mm0.031 dalam
090SQ 100J6618C	100 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	100	0.8 mm0.031 dalam
090SQ 100U6617	100 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	FLEXBGA	100	0.8 mm0.031 dalam
090SQ 100U6618B	100 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	100	0.8 mm0.031 dalam
090SQ 121U6617	110 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	110	0.8 mm0.031 dalam
090SQ 148U6617	148 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	148	0.50 mm0.02 dalam
090SQ 289U6617	289 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	289	0.50 mm0.02 dalam
091081136U6617	36 Input/Output (I/O) dan 0,62 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	36	0.62 mm0.0244 dalam
091SQ 064B6617	64 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	64	1 mm0.039 dalam
093071040U6617	40 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	40	0.50 mm0.02 dalam
094073048U6617	48 Input/Output (I/O) dan 0,75 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	0.75 mm0.03 dalam
096068048U6617	48 Input/Output (I/O) dan 0,75 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	0.75 mm0.03 dalam
096068048U6618A	48 Input/Output (I/O) dan 0,75 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	0.75 mm0.03 dalam
099059180J6617	180 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	180	0.50 mm0.02 dalam
099069040U6617	40 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	40	0.50 mm0.02 dalam
100090036B6617	36 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	PBGA	36	1.27 mm0.05 dalam
100SQ 057J6617	57 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	57	0.8 mm0.031 dalam
100SQ 080U6617	80 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	PBGA	80	0.8 mm0.031 dalam
100SQ 081B6617	81 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	81	1 mm0.039 dalam
100SQ 084B6617	84 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	84	1 mm0.039 dalam
100SQ 084B6618A	84 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	84	1 mm0.039 dalam
100SQ 100U6617	100 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	100	0.8 mm0.031 dalam
100SQ 100U6618A	100 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	100	0.8 mm0.031 dalam
100SQ 100U6618B	100 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	100	0.8 mm0.031 dalam
100SQ 112U6617	112 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	112	0.8 mm0.031 dalam
100SQ 121U6617	121 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	121	0.8 mm0.031 dalam
100SQ 121U6618A	121 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	121	0.8 mm0.031 dalam
100SQ 128U6618A	128 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	128	0.8 mm0.031 dalam
100SQ 144J6617	144 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	144	0.8 mm0.0315 dalam
100SQ 144U6617	144 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	144	0.50 mm0.02 dalam
100SQ 144U6618A	144 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	TABGA	144	0.8 mm0.031 dalam
100SQ 144U6618B	144 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	144	0.8 mm0.031 dalam
100SQ 144U6618C	144 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	144	0.8 mm0.031 dalam
100SQ 144U6618D	144 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	144	0.8 mm0.031 dalam
100SQ 151U6617	151 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	151	0.50 mm0.02 dalam
100SQ 181U6617	181 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	181	0.50 mm0.02 dalam
100SQ 216J6617	216 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	216	0.50 mm0.02 dalam
100SQ 236J6618B	238 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	238	0.50 mm0.02 dalam
100SQ 236U6617	236 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	FCBGA	236	0.50 mm0.02 dalam
100SQ 236U6618A	236 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	236	0.50 mm0.02 dalam
100SQ 275U6617	275 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	275	0.50 mm0.02 dalam
100SQU100U6617	100 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	100	0.8 mm0.031 dalam
103077047U6617	46 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	46	0.65 mm0.026 dalam
103077047U6618A	46 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	46	0.65 mm0.026 dalam
105065135U6617	135 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	135	0.65 mm0.0256 dalam
107056046U6617	44 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	44	0.65 mm0.026 dalam
107056046U6618A	44 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	44	0.65 mm0.026 dalam
110050084U6617	84 Input/Output (I/O) dan 0,75 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	84	0.75 mm0.0295 dalam
110080088U6617	88 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	LFBGA	88	0.8 mm0.031 dalam
110080088U6618A	88 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	LFBGA	88	0.8 mm0.031 dalam
110SQ 080B6617	80 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	FPBGA	80	1 mm0.039 dalam
110SQ 084B6617	84 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	GTPBGA	84	1 mm0.039 dalam
110SQ 084B6618A	84 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	84	1 mm0.039 dalam
110SQ 100B6617	100 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	FLEXBGA	100	1 mm0.039 dalam
110SQ 100B6618A	100 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	FLEXBGA	100	1 mm0.039 dalam
110SQ 100J6617	100 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	FLEXBGA	100	1 mm0.039 dalam
110SQ 106U6617	106 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	106	0.65 mm0.026 dalam
110SQ 124U6617	124 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	124	0.8 mm0.031 dalam
110SQ 128U6617	128 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	128	0.8 mm0.031 dalam
110SQ 128U6618A	128 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	128	0.8 mm0.031 dalam
110SQ 128U6618B	128 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	128	0.8 mm0.031 dalam
110SQ 144U6617	144 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	144	0.8 mm0.031 dalam
110SQ 144U6618A	144 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	144	0.8 mm0.031 dalam
110SQ 169U6617	169 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	FPBGA	169	0.8 mm0.031 dalam
110SQ 278U6617	278 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	278	0.50 mm0.0197 dalam
115075055U6617	55 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	SSBGA	55	0.8 mm0.031 dalam
115075056U6617	56 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	56	0.8 mm0.031 dalam
115110060J6617	60 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	FBGA	60	0.8 mm0.031 dalam
115110060U6617	60 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	FBGA	60	0.8 mm0.031 dalam
117089062U6617	62 Input/Output (I/O) Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	62	Berbagai
117089062U6618A	62 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	62	0.8 mm0.031 dalam
120050119U6617	119 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	119	0.65 mm0.0256 dalam
120070048U6617	48 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	0.8 mm0.031 dalam
120070048U6618A	48 Input/Output (I/O) dan 0,75 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	FPBGA	48	0.75 mm0.03 dalam
120070048U6618B	48 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	FBGA	48	0.8 mm0.031 dalam
120070056U6617	56 Input/Output (I/O) dan 0,75 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	56	0.75 mm0.03 dalam
120080064U6617	64 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	FBGA	64	0.8 mm0.031 dalam
120080064U6618A	64 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	64	0.8 mm0.031 dalam
120080067U6617	67 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	FBGA	67	0.8 mm0.031 dalam
120080204J6617	204 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	204	0.50 mm0.02 dalam
120080228J6617	228 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	228	0.50 mm0.02 dalam
120100048B6617	48 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	1 mm0.039 dalam
120100048B6618A	48 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	1 mm0.039 dalam
120100048B6618B	48 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	1 mm0.039 dalam
120100048B6618C	48 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	1 mm0.039 dalam
120100048U6617	48 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	48	0.8 mm0.031 dalam
120100080B6617	80 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	80	1 mm0.039 dalam
120SQ 084U6617	84 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	84	0.50 mm0.02 dalam
120SQ 099U6617	99 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	99	0.50 mm0.02 dalam
120SQ 112B6617	112 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	112	1 mm0.039 dalam
120SQ 116U6617	116 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	116	0.8 mm0.031 dalam
120SQ 121B6617	121 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	121	1 mm0.039 dalam
120SQ 132U6617	132 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	132	0.8 mm0.031 dalam
120SQ 132U6618A	132 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	132	0.8 mm0.031 dalam
120SQ 144U6617A	144 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	144	0.8 mm0.031 dalam
120SQ 144U6618B	144 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	144	0.8 mm0.031 dalam
120SQ 144U6618C	144 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	144	0.8 mm0.031 dalam
120SQ 144U6618D	144 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	144	0.8 mm0.031 dalam
120SQ 160U6617	160 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	160	0.8 mm0.031 dalam
120SQ 160U6618A	160 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	160	0.8 mm0.031 dalam
120SQ 169J6617	169 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	169	0.8 mm0.031 dalam
120SQ 179U6617	179 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	179	0.8 mm0.031 dalam
120SQ 179U6618A	179 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	179	0.8 mm0.031 dalam
120SQ 179U6618B	179 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	179	0.8 mm0.031 dalam
120SQ 180U6617	180 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	180	0.8 mm0.031 dalam
120SQ 180U6618A	180 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	180	0.8 mm0.031 dalam
120SQ 180U6618B	180 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	180	0.8 mm0.031 dalam
120SQ 196U6617	196 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	196	0.8 mm0.031 dalam
120SQ 196U6618A	196 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	196	0.8 mm0.031 dalam
120SQ 228U6617	228 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	228	0.50 mm0.02 dalam
120SQ 254U6617	254 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	254	0.50 mm0.02 dalam

Item #	Nama Item	Nama Paket	Jumlah input/output (I/O)	Pitch
120SQ 254U6618A	254 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	254	0.50 mm0.02 dalam
120SQ 260U6617	260 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	260	0.50 mm0.02 dalam
120SQ 289U6617	289 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	289	0.65 mm0.026 dalam
120SQ 300U6617	300 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	300	0.50 mm0.02 dalam
120SQ 308U6617	308 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	308	0.50 mm0.02 dalam
120SQ 308U6618A	308 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	308	0.50 mm0.02 dalam
120SQ 405U6617	405 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	405	0.50 mm0.02 dalam
120SQU121B6617	121 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	121	1 mm0.039 dalam
120SQU121P6617	121 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	121	1 mm0.039 dalam
120SQU144U6618A	144 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	144	0.8 mm0.031 dalam
120SQU254U6617	254 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	254	0.50 mm0.02 dalam
120SQU254U6618A	254 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	254	0.50 mm0.02 dalam
125110154J6617	154 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	154	0.8 mm0.0315 dalam
129116054P6617	54 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	54	1.27 mm0.05 dalam
130100054B6617	54 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	54	1 mm0.039 dalam
130100064B6617	64 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	64	1 mm0.039 dalam
130110185U6617	185 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	185	0.8 mm0.031 dalam
130112062U6617	62 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	62	1 mm0.039 dalam
130SQ 080B6617	80 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	80	1 mm0.039 dalam
130SQ 080B6618A	80 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	80	1 mm0.039 dalam
130SQ 080B6618B	143 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	143	1 mm0.039 dalam
130SQ 108B6617	108 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	108	1 mm0.039 dalam
130SQ 144B6617	144 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	144	1 mm0.039 dalam
130SQ 144B6618A	144 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	144	1 mm0.039 dalam
130SQ 144B6618B	144 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	144	1 mm0.039 dalam
130SQ 144B6618C	144 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	144	1 mm0.039 dalam
130SQ 144P6618A	144 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	144	1 mm0.039 dalam
130SQ 144U6617	144 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	144	0.8 mm0.031 dalam
130SQ 144U6618A	144 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	144	0.8 mm0.031 dalam
130SQ 160U6617	160 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	160	0.8 mm0.031 dalam
130SQ 180U6617	180 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	180	0.8 mm0.031 dalam
130SQ 200U6617	200 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	200	0.8 mm0.031 dalam
130SQ 200U6618A	24 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	24	0.8 mm0.031 dalam
130SQ 208U6617	208 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	208	0.8 mm0.031 dalam
130SQ 224U6617	224 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	224	0.8 mm0.031 dalam
130SQ 224U6618A	224 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	224	0.8 mm0.031 dalam
130SQ 225U6617	225 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	225	0.8 mm0.031 dalam
130SQ 225U6618A	225 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	225	0.8 mm0.031 dalam
130SQ 225U6618B	225 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	225	0.8 mm0.031 dalam
130SQ 237U6617	237 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	237	0.65 mm0.0256 dalam
130SQ 276U6617	276 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	276	0.50 mm0.02 dalam
130SQ 300U6617	300 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	300	0.50 mm0.02 dalam
130SQ 341U6617	341 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	341	0.50 mm0.02 dalam
130SQ 356U6617	356 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	356	0.50 mm0.02 dalam
130SQ 356U6618A	356 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	356	0.50 mm0.02 dalam
130SQ 361U6617	361 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	361	0.65 mm0.0256 dalam
130SQ 416U6617	362 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	362	0.50 mm0.02 dalam
130SQ 417U6617	417 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	417	0.50 mm0.02 dalam
130SQ 625U6617	625 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	625	0.50 mm0.02 dalam
135055096U6617	96 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	96	0.8 mm0.031 dalam
140070184U6617	184 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	184	0.50 mm0.02 dalam
140090123U6617	123 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	123	0.8 mm0.031 dalam
140100150U6617	150 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	150	0.8 mm0.031 dalam
140120190U6617	190 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	190	0.65 mm0.0256 dalam
140SQ 165U6617	165 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	165	0.8 mm0.031 dalam
140SQ 167U6617	167 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	167	0.50 mm0.02 dalam
140SQ 192U6617	192 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	192	0.8 mm0.031 dalam
140SQ 232U6617	232 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	232	0.8 mm0.031 dalam
140SQ 256U6617	256 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	0.8 mm0.031 dalam
140SQ 256U6618A	256 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	0.8 mm0.031 dalam
140SQ 256U6618B	256 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	0.8 mm0.031 dalam
140SQ 344U6617	344 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	344	0.50 mm0.02 dalam
140SQ 356U6617	356 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	356	0.50 mm0.02 dalam
140SQ 408U6617	408 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	408	0.50 mm0.02 dalam
140SQ 436U6617	436 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	436	0.50 mm0.02 dalam
140SQ 484U6617	469 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	469	0.50 mm0.02 dalam
144122106U6617	106 Input/Output (I/O) dan 0,75 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	106	0.75 mm0.03 dalam
144122106U6618A	106 Input/Output (I/O) dan 0,75 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	106	0.75 mm0.03 dalam
144141191U6617	191 Input/Output (I/O) dan 0,76 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	191	0.76 mm0.03 dalam
150SQ 144B6617	144 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	144	1 mm0.039 dalam
150SQ 144B6618A	144 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	144	1 mm0.039 dalam
150SQ 176B6617	176 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	176	1 mm0.039 dalam
150SQ 176U6617	176 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	176	0.8 mm0.031 dalam
150SQ 196B6617	196 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	196	1 mm0.039 dalam
150SQ 196B6618A	196 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	196	1 mm0.039 dalam
150SQ 196B6618B	196 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	196	1 mm0.039 dalam
150SQ 196B6618C	196 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	196	1 mm0.039 dalam
150SQ 196B6618G	196 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	196	1 mm0.039 dalam
150SQ 196B6618H	196 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	196	1 mm0.039 dalam
150SQ 196B6618J	196 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	196	1 mm0.039 dalam
150SQ 196B6618K	196 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	196	1 mm0.039 dalam
150SQ 196J6617	196 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	196	1 mm0.039 dalam
150SQ 196J6618A	196 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	196	1 mm0.039 dalam
150SQ 208U6617	208 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	208	0.8 mm0.031 dalam
150SQ 208U6618A	208 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	208	0.8 mm0.031 dalam
150SQ 208U6618B	208 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	208	0.8 mm0.031 dalam
150SQ 233U6617	233 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	233	0.8 mm0.031 dalam
150SQ 233U6618A	233 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	233	0.8 mm0.031 dalam
150SQ 233U6618B	233 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	233	0.8 mm0.031 dalam
150SQ 233U6618C	233 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	233	0.8 mm0.031 dalam
150SQ 240J6617	240 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	240	0.8 mm0.031 dalam
150SQ 240U6617	240 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	240	0.8 mm0.031 dalam
150SQ 256U6617	256 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	0.8 mm0.031 dalam
150SQ 261U6617	261 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	261	0.8 mm0.031 dalam
150SQ 280U6617	280 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	280	0.8 mm0.031 dalam
150SQ 324U6617	324 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	324	0.8 mm0.031 dalam
150SQ 324U6618A	324 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	324	0.8 mm0.031 dalam
150SQ 324U6618B	324 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	324	0.8 mm0.031 dalam
150SQ 481U6617	481 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	481	0.65 mm0.026 dalam
150SQ 571J6617	571 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	571	0.50 mm0.0197 dalam
153093027J6617	27 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	27	1.27 mm0.05 dalam
153093027J6618A	27 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	27	1.27 mm0.05 dalam
153093029J6617	66 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	66	1.27 mm0.05 dalam
160055114U6617	114 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	114	0.8 mm0.031 dalam
160SQ 132B6617	132 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	132	1 mm0.039 dalam
160SQ 209U6617	209 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	209	0.8 mm0.031 dalam
160SQ 212U6617	212 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	212	0.8 mm0.031 dalam
160SQ 224U6617	224 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	224	0.8 mm0.031 dalam
160SQ 227U6617	227 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	227	0.8 mm0.031 dalam
160SQ 228U6617	228 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	228	0.8 mm0.031 dalam
160SQ 240U6617	240 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	240	0.8 mm0.031 dalam
160SQ 257U6617	257 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	257	0.8 mm0.031 dalam
160SQ 280U6617	280 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	280	0.8 mm0.031 dalam
160SQ 280U6618A	280 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	280	0.8 mm0.031 dalam
160SQ 285U6617	285 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	285	0.8 mm0.031 dalam
160SQ 288U6617	288 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	288	0.8 mm0.031 dalam
160SQ 408U6617	408 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	408	0.50 mm0.02 dalam
160SQU285U6617	285 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	285	0.8 mm0.031 dalam
160SQU285U6618A	285 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	285	0.8 mm0.031 dalam
169SQ 168B6617	168 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	168	1.27 mm0.05 dalam
169SQ 168J6617	168 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	168	1.27 mm0.05 dalam
169SQ 168J6618A	168 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	168	1.27 mm0.05 dalam
170100376U6617	376 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	376	0.50 mm0.02 dalam
170110120B6617	120 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	120	1 mm0.039 dalam
170131168U6617	168 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	168	0.8 mm0.031 dalam
170SQ 196B6618A	196 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	196	1 mm0.039 dalam
170SQ 208B6617	208 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	208	1 mm0.039 dalam
170SQ 208B6618A	208 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	208	1 mm0.039 dalam
170SQ 208B6618B	208 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	208	1 mm0.039 dalam
170SQ 208B6618C	208 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	208	1 mm0.039 dalam
170SQ 208B6618D	208 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	208	1 mm0.039 dalam
170SQ 220B6617	220 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	220	1 mm0.039 dalam
170SQ 228B6617	228 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	228	1 mm0.039 dalam
170SQ 236B6617	236 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	236	1 mm0.039 dalam
170SQ 256B6617	256 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1 mm0.039 dalam
170SQ 256B6618A	256 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1 mm0.039 dalam
170SQ 256B6618B	256 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1 mm0.039 dalam
170SQ 256B6618C	256 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1 mm0.039 dalam
170SQ 256B6618D	256 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1 mm0.039 dalam
170SQ 256B6618E	256 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1 mm0.039 dalam
170SQ 256B6618F	256 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1 mm0.039 dalam
170SQ 256B6618G	256 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1 mm0.039 dalam
170SQ 256B6618J	256 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1 mm0.039 dalam
170SQ 256B6618K	256 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1 mm0.039 dalam
170SQ 256B6618L	256 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1 mm0.039 dalam
170SQ 256B6618N	256 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1 mm0.039 dalam
170SQ 256U6617	256 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	0.8 mm0.031 dalam
170SQ 316U6617	316 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	316	0.8 mm0.031 dalam
170SQ 332U6617	332 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	332	0.8 mm0.031 dalam
170SQ 361J6617	361 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	361	0.8 mm0.031 dalam
170SQ 399U6617	399 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	399	0.8 mm0.031 dalam
170SQ 537U6617	537 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	537	0.65 mm0.026 dalam
170SQU256B6618	256 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1 mm0.039 dalam
171102092U6617	92 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	92	0.8 mm0.031 dalam
180084260J6617	260 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	260	0.50 mm0.02 dalam
180140064B6617	64 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	64	1 mm0.039 dalam
180141047B6617	47 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	47	1 mm0.039 dalam
180141064J6617	64 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	64	1 mm0.039 dalam
180141064P6617	64 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	HPS BGA	64	1 mm0.039 dalam
180SQ 320U6617	320 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	320	0.8 mm0.031 dalam
190SQ 120B6617	120 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	120	1 mm0.039 dalam
190SQ 225B6617	225 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	225	1 mm0.039 dalam
190SQ 233B6617	233 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	233	1 mm0.0394 dalam
190SQ 256B6617	256 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1 mm0.039 dalam
190SQ 276B6617	276 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	276	1 mm0.039 dalam
190SQ 288U6617	288 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	288	0.8 mm0.031 dalam
190SQ 288U6618A	288 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	288	0.8 mm0.031 dalam
190SQ 300B6617	300 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	300	1 mm0.039 dalam
190SQ 324B6617	324 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	324	1 mm0.039 dalam
190SQ 324B6618A	324 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	324	1 mm0.039 dalam
190SQ 324B6618B	324 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	324	1 mm0.039 dalam
190SQ 324B6618C	324 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	324	1 mm0.039 dalam
190SQ 324B6618D	324 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	324	1 mm0.039 dalam
190SQ 324B6618E	324 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	324	1 mm0.039 dalam
190SQ 324J6617	324 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	324	1 mm0.039 dalam
190SQ 352U6617	352 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	352	0.8 mm0.031 dalam
190SQ 375U6617	375 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	375	0.8 mm0.031 dalam
190SQ 399U6617	399 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	399	0.8 mm0.031 dalam
190SQ 399U6618A	399 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	399	0.8 mm0.031 dalam
190SQ 424U6617	424 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	424	0.8 mm0.031 dalam
190SQ 484U6617	484 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	484	0.8 mm0.031 dalam
203SQ 128B6617	128 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	128	1 mm0.039 dalam
203SQ 324B6617	324 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	324	1 mm0.039 dalam
204099237J6618A	595 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	595	0.50 mm0.0197 dalam
204099595J6618A	595 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	595	0.50 mm0.0197 dalam
206SQ 128B6617	128 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	128	1 mm0.039 dalam
210106237J6618A	595 Input/Output (I/O) dan 0,50 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	595	0.50 mm0.0197 dalam
210SQ 364B6617	364 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	364	1 mm0.039 dalam
210SQ 364J6617	364 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	364	1 mm0.039 dalam
210SQ 400B6617	400 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	400	1 mm0.039 dalam
210SQ 400B6618A	400 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	400	1 mm0.039 dalam
215SQ 289B6617	289 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	289	1 mm0.039 dalam
220140119B6617	119 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	119	1.27 mm0.05 dalam
220140119B6618A	119 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	119	1.27 mm0.05 dalam
220160238B6617	238 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	238	1 mm0.039 dalam
225SQ 289B6617	289 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	289	1 mm0.039 dalam
230SQ 217B6617	217 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	217	1.27 mm0.05 dalam
230SQ 233B6617	233 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	233	1.27 mm0.05 dalam
230SQ 233B6618A	233 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	233	1.27 mm0.05 dalam
230SQ 233B6618B	233 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	233	1.27 mm0.05 dalam

230SQ 240B6617	240 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	240	1.27 mm0.05 dalam
230SQ 312B6617	312 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	312	1.27 mm0.05 dalam
230SQ 324B6618A	324 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	324	1 mm0.039 dalam
230SQ 324B6618B	324 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	324	1 mm0.039 dalam
230SQ 324B6618C	324 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	324	1 mm0.039 dalam
230SQ 338B6617	338 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	338	1 mm0.039 dalam
230SQ 340B6617	340 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	340	1 mm0.039 dalam
230SQ 388B6617	388 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	388	1 mm0.039 dalam
230SQ 456B6617	456 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	456	1 mm0.039 dalam
230SQ 456B6618A	456 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	456	1 mm0.039 dalam
230SQ 484B6617	484 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	484	1 mm0.039 dalam
230SQ 484B6618A	484 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	484	1 mm0.039 dalam
230SQ 484B6618B	484 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	484	1 mm0.039 dalam
230SQ 484B6618C	484 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	484	1 mm0.039 dalam
230SQ 484wB6618D	484 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	484	1 mm0.039 dalam
2401900w90U6617	90 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	90	0.8 mm0.031 dalam
240190090U6618A	90 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	90	0.8 mm0.031 dalam
250133600U6617	600 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	600	0.65 mm0.0256 dalam
250210255B6617	255 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	255	1.27 mm0.05 dalam
250SQ 320B6617	320 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	320	1 mm0.039 dalam
250SQ 320B6618A	320 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	320	1 mm0.039 dalam
250SQ 575B6617	575 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	575	1 mm0.039 dalam
250SQ 575B6618A	575 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	575	1 mm0.039 dalam
252135588U6617	588 Input/Output (I/O) dan 0,65 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	588	0.65 mm0.0256 dalam
270140544U6617	544 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	544	0.8 mm0.0315 dalam
270SQ 225B6617	225 Input/Output (I/O) dan 1.5 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	225	1.5 mm0.059 dalam
270SQ 228J6618A	368 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	368	1 mm0.039 dalam
270SQ 256B1618B	256 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1.27 mm0.05 dalam
270SQ 256B6617	256 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1.27 mm0.05 dalam
270SQ 256B6618A	256 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1.27 mm0.05 dalam
270SQ 256B6618B	256 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1.27 mm0.05 dalam
270SQ 256B6618D	256 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1.27 mm0.05 dalam
270SQ 256B6618E	256 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1.27 mm0.05 dalam
270SQ 256B6618F	256 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1.27 mm0.05 dalam
270SQ 256B6618G	256 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1.27 mm0.05 dalam
270SQ 256B6618H	256 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1.27 mm0.05 dalam
270SQ 256B6618I	256 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1.27 mm0.05 dalam
270SQ 256B6618J	256 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1.27 mm0.05 dalam
270SQ 272B6617	272 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	272	1.27 mm0.05 dalam
270SQ 272B6618A	272 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	272	1.27 mm0.05 dalam
270SQ 272B6618B	272 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	272	1.27 mm0.05 dalam
270SQ 272M6617	272 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	272	1.27 mm0.05 dalam
270SQ 280B6617	280 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	280	1.27 mm0.05 dalam
270SQ 292B6617	292 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	292	1.27 mm0.05 dalam
270SQ 292B6618A	292 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	292	1.27 mm0.05 dalam
270SQ 296B6617	296 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	296	1.27 mm0.05 dalam
270SQ 300B6617	300 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	300	1.27 mm0.05 dalam
270SQ 300B6618A	300 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	300	1.27 mm0.05 dalam
270SQ 316B6617	316 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	316	1.27 mm0.05 dalam
270SQ 316B6618A	316 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	316	1.27 mm0.05 dalam
270SQ 324B6617	324 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	324	1.27 mm0.05 dalam
270SQ 324B6618A	324 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	324	1.27 mm0.05 dalam
270SQ 328B6617	328 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	328	1.27 mm0.05 dalam
270SQ 328B6618A	328 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	328	1.27 mm0.05 dalam
270SQ 336B6617	336 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	336	1.27 mm0.05 dalam
270SQ 336B6618A	336 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	336	1.27 mm0.05 dalam
270SQ 352B6618A	352 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	352	1.27 mm0.05 dalam
270SQ 352B6618C	352 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	352	1 mm0.039 dalam
270SQ 388B6617	388 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	388	1.27 mm0.05 dalam
270SQ 400B6617	400 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	400	1.27 mm0.05 dalam
270SQ 400B6618A	400 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	400	1.27 mm0.05 dalam
270SQ 420B6617	420 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	420	1 mm0.039 dalam
270SQ 484B6617	484 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	484	1 mm0.039 dalam
270SQ 558J6617	368 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	368	1 mm0.039 dalam
270SQ 668B6617	668 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	668	1 mm0.039 dalam
270SQ 672B6617	672 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	672	1 mm0.039 dalam
270SQ 672B6618A	672 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	672	1 mm0.039 dalam
270SQ 672B6618B	672 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	672	1 mm0.039 dalam
270SQ 672B6618C	158 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	158	1 mm0.039 dalam
270SQ 672B6618D	672 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	672	1 mm0.039 dalam
270SQ 672B6618E	672 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	672	1 mm0.039 dalam
270SQ 676B6617	676 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	676	1 mm0.039 dalam
270SQ 960J6617	960 Input/Output (I/O) dan 0,8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	960	0.8 mm0.0315 dalam
270SQD256B6618A	256 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	256	1.27 mm0.05 dalam
282250269B6617	544 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	544	1 mm0.039 dalam
290SQ 266B6617	266 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	266	1 mm0.039 dalam
290SQ 472B6617	472 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	472	1.27 mm0.05 dalam
290SQ 780B6617	780 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	780	1 mm0.039 dalam
310SQ 304B6617	304 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	304	1.27 mm0.05 dalam
310SQ 304B6618B	304 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	304	1.27 mm0.05 dalam
310SQ 304B6618C	304 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	304	1.27 mm0.05 dalam
310SQ 329B6617	329 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	329	1.27 mm0.05 dalam
310SQ 329B6618A	329 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	329	1.27 mm0.05 dalam
310SQ 385B6617	385 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	385	1.27 mm0.05 dalam
310SQ 458B6617	458 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	458	1 mm0.039 dalam
310SQ 484B6617	484 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	484	1 mm0.039 dalam
310SQ 529B6617	529 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	529	1.27 mm0.05 dalam
310SQ 538B6617	538 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	538	1 mm0.039 dalam
310SQ 538B6618A	538 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	538	1 mm0.039 dalam
310SQ 556B6617	556 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	556	1 mm0.039 dalam
310SQ 560B6617	560 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	560	1 mm0.039 dalam
310SQ 657J6617	657 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	657	1 mm0.039 dalam
310SQ 676B6617	676 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	676	1 mm0.039 dalam
310SQ 696B6617	696 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	696	1 mm0.039 dalam
310SQ 696B6618A	696 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	696	1 mm0.039 dalam
310SQ 708B6617	708 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	708	1 mm0.039 dalam
310SQ 708B6618A	708 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	708	1 mm0.039 dalam
310SQ 896B6617	896 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	896	1 mm0.039 dalam
310SQ 900B6617	900 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	900	1 mm0.039 dalam
310SQ 900B6618A	900 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	900	1 mm0.039 dalam
310SQ 925B6617	925 Input/Output (I/O) dan 0,983 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	925	0.983 mm0.0387 dalam
325250720B6617	720 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	720	1 mm0.039 dalam
330SQ 229B6617	229 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	229	1 mm0.039 dalam
330SQ1020B6617	1020 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	1020	1 mm0.039 dalam
330SQ1020B6618A	1020 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	1020	1 mm0.039 dalam
350310462B6617	440 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	440	1.27 mm0.05 dalam
350SQ 304B6618	304 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	304	1.27 mm0.05 dalam
350SQ 313B6617	313 Input/Output (I/O) dan 1.8 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	313	1.8 mm0.0707 dalam
350SQ 313B6618A	313 Input/Output (I/O) dan 3.592 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	313	3.592 mm0.141 dalam
350SQ 352B6617	352 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	352	1.27 mm0.05 dalam
350SQ 352B6618A	352 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	352	1.27 mm0.05 dalam
350SQ 352B6618B	352 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	Super BGA	352	1.27 mm0.05 dalam
350SQ 352B6618C	352 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	352	1.27 mm0.05 dalam
350SQ 352B6618D	352 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	352	1.27 mm0.05 dalam
350SQ 352B6618E	352 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	352	1.27 mm0.05 dalam
350SQ 352B6618F	352 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	352	1.27 mm0.05 dalam
350SQ 352B6618G	352 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	352	1.27 mm0.05 dalam
350SQ 356B6617	356 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	356	1.27 mm0.05 dalam
350SQ 368B6617	368 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	368	1.27 mm0.05 dalam
350SQ 368B6618	368 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	368	1.27 mm0.05 dalam
350SQ 371B6617	371 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	371	1.27 mm0.05 dalam
350SQ 388B6617	388 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	388	1.27 mm0.05 dalam
350SQ 388B6618A	388 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	388	1.27 mm0.05 dalam
350SQ 388B6618B	388 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	388	1.27 mm0.05 dalam
350SQ 388B6618C	388 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	388	1.27 mm0.05 dalam
350SQ 388B6618D	388 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	388	1.27 mm0.05 dalam
350SQ 420B6617	420 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	420	1.27 mm0.05 dalam
350SQ 420B6618A	420 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	420	1.27 mm0.05 dalam
350SQ 432B6618	432 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	432	1.27 mm0.05 dalam
350SQ 440B6618	340 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	340	1.27 mm0.05 dalam
350SQ 440B6618A	440 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	440	1.27 mm0.05 dalam
350SQ 452B6617	452 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	452	1.27 mm0.05 dalam
350SQ 456B6617	456 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	456	1.27 mm0.05 dalam
350SQ 456B6618	456 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	456	1.27 mm0.05 dalam
350SQ 456B6618A	456 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	456	1.27 mm0.05 dalam
350SQ 456B6618B	456 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	456	1.27 mm0.05 dalam
350SQ 456B6618C	456 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	456	1.27 mm0.05 dalam
350SQ 456B6618D	456 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	456	1.27 mm0.05 dalam
350SQ 464B6618	464 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	464	1.27 mm0.05 dalam
350SQ 476B6617	432 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	432	1.27 mm0.05 dalam
350SQ 492B6617	492 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	492	1.27 mm0.05 dalam
350SQ 492B6618A	492 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	492	1.27 mm0.05 dalam
350SQ 505B6617	505 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	505	1.27 mm0.05 dalam
350SQ 516B6617	516 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	516	1.27 mm0.05 dalam
350SQ 560B6617	560 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	560	1.27 mm0.05 dalam
350SQ 580B6617	580 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	580	1 mm0.039 dalam
350SQ 580B6618A	580 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	580	1 mm0.039 dalam
350SQ 625B6617	625 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	625	1.27 mm0.05 dalam
350SQ 664B6617	664 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	664	1.27 mm0.05 dalam
350SQ 664C6617	664 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	664	1.27 mm0.05 dalam
350SQ 672B6617	672 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	672	1.27 mm0.05 dalam
350SQ 672B6618A	672 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	672	1.27 mm0.05 dalam
350SQ 676B6617	676 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	676	1.27 mm0.05 dalam
350SQ 676B6618A	676 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	676	1.27 mm0.05 dalam
350SQ 676B6618B	676 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	676	1.27 mm0.05 dalam
350SQ 700B6617	700 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	700	1 mm0.039 dalam
350SQ 787B6617	787 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	787	1 mm0.039 dalam
350SQ 788B6617	788 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	788	1 mm0.039 dalam
350SQ1148B6617	1148 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket	BGA/CSP	1148	1 mm0.039 dalam
350SQ1156B6617	1155 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket	BGA/CSP	1155	1 mm0.039 dalam
350SQ1156B6618A	1156 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket	BGA/CSP	1156	1 mm0.039 dalam
350SQ1156B6618C	1152 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	1152	1 mm0.039 dalam
350SQ1156B6618D	1156 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket	BGA/CSP	1156	1 mm0.039 dalam
350SQ1156J6617	1155 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket	BGA/CSP	1155	1 mm0.039 dalam
350SQD352B6618	352 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	352	1.27 mm0.05 dalam
350SQD352B6618A	352 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	352	1.27 mm0.05 dalam
350SQU388B6617	388 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	388	1.27 mm0.05 dalam
375SQ 312B6617	312 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	312	1.27 mm0.05 dalam
375SQ 529B6617	529 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	529	1.27 mm0.05 dalam
375SQ 553B6617	553 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	553	1.27 mm0.05 dalam
375SQ 587B6617	587 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	587	1.27 mm0.05 dalam
375SQ 652B6617	652 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	652	1.27 mm0.05 dalam
375SQ 901B6617	901 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	901	1 mm0.039 dalam
400SQ 232B6617	1521 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	1521	1 mm0.039 dalam
400SQ 432B6617	432 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	432	1.27 mm0.05 dalam
400SQ 503B6617	503 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	503	1.27 mm0.05 dalam
400SQ 520B6617	520 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	520	1.27 mm0.05 dalam
400SQ 520B6618A	520 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	520	1.27 mm0.05 dalam
400SQ 520B6618B	520 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	520	1.27 mm0.05 dalam
400SQ 520B6618C	520 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	520	1.27 mm0.05 dalam
400SQ 560B6617	560 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	560	1.27 mm0.05 dalam
400SQ 569B6617	569 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	569	1.27 mm0.05 dalam
400SQ 569B6618A	569 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	569	1.27 mm0.05 dalam
400SQ 600B6617	600 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	600	1.27 mm0.05 dalam
400SQ 624B6617	624 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	624	1.27 mm0.05 dalam
400SQ 665B6617	665 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	665	1.27 mm0.05 dalam
400SQ 680B6617	680 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	680	1 mm0.039 dalam
400SQ 680B6618A	680 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	680	1 mm0.039 dalam
400SQ 680B6618B	680 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	680	1 mm0.039 dalam
400SQ 729B6617	729 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	729	1.27 mm0.05 dalam
400SQ 913B6617	913 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket	BGA/CSP	913	1 mm0.039 dalam
400SQ 956B6617	956 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	956	1.27 mm0.05 dalam
400SQ1000B6617	1000 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	1000	1 mm0.039 dalam
400SQ1004B6617	1004 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	1004	1 mm0.039 dalam
400SQ1069B6617	1063 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	1063	1 mm0.039 dalam
400SQ1117B6617	1121 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket	BGA/CSP	1121	1 mm0.039 dalam
400SQ1121B6617	1121 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket	BGA/CSP	1121	1 mm0.039 dalam
400SQ1157B6617	1157 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket	BGA/CSP	1157	1 mm0.039 dalam
400SQ1157B6618A	1157 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket	BGA/CSP	1157	1 mm0.039 dalam
400SQ1417B6617	1413 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket	BGA/CSP	1413	1 mm0.039 dalam

400SQ1417B6618A	1413 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket	BGA/CSP	1413	1 mm0.039 dalam
400SQ1417B6618B	1413 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket	BGA/CSP	1413	1 mm0.039 dalam
400SQ1508B6617	1508 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	1508	1 mm0.039 dalam
400SQ1508B6618A	1508 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	1508	1 mm0.039 dalam
400SQ1517B6617	1517 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	1517	1 mm0.039 dalam
425SQ 560B6617	560 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	560	1.27 mm0.05 dalam
425SQ 560B6618A	560 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	560	1.27 mm0.05 dalam
425SQ 860B6617	860 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	860	1 mm0.039 dalam
425SQ1764B6617	1760 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	1760	1 mm0.039 dalam
430SQ 521B6617	521 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	521	1.27 mm0.05 dalam
450SQ 600B6617	600 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	600	1.27 mm0.05 dalam
450SQ 600B6618A	600 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	600	1.27 mm0.05 dalam
450SQ 655B6617	655 Input/Output (I/O) dan 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	655	1.27 mm0.05 dalam
450SQ1936B6617	1936 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	1936	1 mm0.0394 dalam
500SQ 836B6617	836 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	836	1 mm0.039 dalam
500SQ1428B6617	1428 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket	BGA/CSP	1428	1 mm0.039 dalam
500SQ2397B6617	2397 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket	BGA/CSP	2397	1 mm0.039 dalam
500SQ2401B6617	2401 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket	BGA/CSP	2401	1 mm0.039 dalam
528SQ 106B6617	2549 Input/Output (I/O) dan 1 Millimeter (mm) Pitch Ball Grid Array (BGA) / Chip Scale Package (CSP) Socket	BGA/CSP	2549	1 mm0.039 dalam
135120083J6617	83 Paket BGA Timah	BGA	83	1.000 mm